TECHNOLOGIES

Mektec FPC Technologies

Our technology range goes from single sided FPC to double-sided and multilayer flexible printed circuits (FPCs) as well as flexible printed circuits with assembly (FPCA), precision components and FPC with sealing.

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SINGLE SIDED FPC

Single-sided flexible printed circuits (FPCs) have a basic layer stackup with one copper layer. Accessible from the top as well as from underneath.

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DOUBLE SIDED FPC

The two conductive layers of a double-sided flexible printed circuit (FPC) are connected electrically via plated through holes or plated micro-via's.

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MULTI-LAYER FPC

Multilayer flexible printed circuits (FPCs) have up to eight layers to route out HDI (High Density Interconnect) areas. The high layer count is reduced partially to create flexible areas. Flexibility can be further increased by forming an air gap build-up.

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FPC ASSEMBLY

A wide range of possibilities to connect flexible printed circuits (FPCs)electrically or mechanically exist today. The most frequently used solution is to solder flexible printed circuit (FPC), but there are much more technologies available.

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FPC + PRECISION COMPONENTS

Precision components are supporting the flexible printed circuit (FPC) to get the proper 3D shape as well as to integrate additional mechanical functions.

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FPC + SEALING

Flexible printed circuits (FPCs) with sealing enable our customers to design water or dust resistant products with an electrical connection out of the protected area.