Mektec and IRISO Electronics Co., Ltd. to Co-Exhibit at CES 2026

Santa Clara, California – November 10, 2025 – Mektec, a global leader in Flexible Printed Circuits, is proud to announce its participation in CES 2026, taking place January 6–9 at the Las Vegas Convention Center. This year, Mektec will be co-exhibiting with IRISO, a leader in advanced interconnects, at booth 5459 in the LVCC West Hall.

At CES, the leading global tech gathering, Mektec and IRISO are taking part in a unique opportunity to present their latest innovations and work together on solutions that tackle the evolving challenges of the technological hardware market.

Visitors to booth 5459 can expect to see:

• Flexible Printed Circuits: Mektec’s advanced FPC technologies designed for compact, robust, and thermally high performance applications.

• Next-Generation Connectors: IRISO’s high-speed and robust interconnect solutions.

Mektec and IRISO invite all CES 2026 attendees to visit booth 5459 in the West Hall to explore how their combined expertise is driving innovation across industries. To schedule a meeting during CES, click “Contact” at the bottom of the “Home” page.

About Mektec

Mektec is a global leader in flexible printed circuit (FPC) technology, offering innovative solutions for compact and high-density electronic applications. With a commitment to precision and reliability, Mektec supports a wide range of industries including automotive, mobile devices, and medical equipment. Headquarters are located in Tokyo, Japan.

About IRISO

Headquartered in Japan, IRISO is a leading manufacturer of advanced interconnect solutions, serving global markets in automotive, industrial, and consumer electronics. With a focus on quality, innovation, and customer satisfaction, IRISO continues to deliver high-performance connectors that meet the demands of tomorrow’s technologies.